Content Hubs and Community Roundtables
An exclusive opportunity for DIA Community Members.
Content Hubs are non-traditional learning/networking hybrid sessions designed for small groups of DIA Community leaders and attendees to connect and gain rapid insights to attain a deeper perspective in 30 minutes.
A vital component of the Content Hub is audience participation to create an active and engaging Q&A, so come prepared!
All Content Hub abstracts must be submitted by a member of a DIA Community.
Abstracts submitted by non-members will not be considered. Not a member? Join a Community.
Accepted Content Hub presenters receive discounted registration rates. The presenting author(s) will receive a 10% discount* on their registration to the in-person DIA 2023 Global Annual Meeting in Boston, MA.
*The discount will be applied to the presenting author's registration category, is nontransferable, and cannot be combined with other offers.
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Important Deadlines
- Monday, January 16: Call for Content Hubs Opens
- Wednesday, March 15: Call for Content Hubs Closes
- Week of April 3: Abstract Notifications Sent
For questions regarding Content Hubs, please contact AnnualMeetingProgram@DIAglobal.org
Call for Community Round Table Discussions
Community Round Table Discussions are 60-minute DIA Community member-facilitated discussions that are inspired by sessions within the DIA 2023 program. This is an exclusive opportunity for DIA Community members to continue the dialogue and develop connections with current and potential community members. Community Round Table Discussions are designed to carry learning and debate from sessions to real-life application and discussion.
All Community Round Table Discussions must be submitted by a member of a DIA Community.
Submissions by non-members will not be considered. Not a member? Join a Community. -
Important Deadlines
- Tuesday, February 14: Call for Community Round Table Discussions Opens
- Wednesday, March 15: Call for Community Round Table Discussions Closes
- Week of April 3: Notifications Sent
For questions, please contact AnnualMeetingProgram@DIAglobal.org